Vertiv has announced that its 2.3 MW Vertiv CoolChip coolant distribution unit (CDU) has qualified as an NVIDIA DSX Ready CDU, making it the first CDU specifically qualified under the NVIDIA DSX Ready program.
The qualification gives AI data center builders a way to identify cooling infrastructure that meets applicable NVIDIA DSX requirements as they design and scale AI factories.
Cooling for high-density AI infrastructure
A CDU manages the flow and temperature of liquid used to remove heat from high-density computing systems. Vertiv’s 2.3 MW model is part of its liquid-to-liquid CDU portfolio and supports direct-to-chip cooling and rear-door heat exchanger applications.
The CDU is designed for installation at the end of a data center row or along the room perimeter, helping operators manage the thermal demands of increasingly dense AI computing environments.
Vertiv Chief Product and Technology Officer Scott Armul said the growing scale of AI deployment requires data center operators to consider compute, power, and cooling as an integrated system.
The NVIDIA DSX AI Factory Platform brings together compute, networking, power, cooling, facilities, and software to help organizations design and operate AI infrastructure within available power, cooling, water, and grid constraints.
The DSX Ready program connects specific infrastructure products with applicable NVIDIA DSX requirements. For CDU providers, qualification uses NVIDIA’s CDU self-qualification suite to assess applicable functional requirements.
Vertiv said the qualification does not replace site-specific engineering. Customers still need to determine how a qualified CDU fits their facility design, system configuration, and operating requirements.
As AI workloads continue driving higher compute density, liquid cooling is becoming an increasingly important component of AI data center infrastructure, helping facilities manage heat while supporting the performance and scalability of AI systems.
