Rapidus, Cadence integrate agentic AI to accelerate advanced chip design
Rapidus Corporation and Cadence have announced a collaboration to integrate the Cadence InnoStack AI Super Agent into the Rapidus AI-Agentic Design Solution (Raads), aiming to improve productivity and accelerate the development of advanced-node system-on-chip (SoC) designs through agentic AI.
The partnership combines Rapidus’ AI-native semiconductor design and manufacturing ecosystem with Cadence’s AI-driven design orchestration technology. By automating and coordinating complex engineering workflows across the SoC design lifecycle, the companies aim to help design teams reduce development time, improve design quality, and speed up time to market.
As part of the collaboration, Rapidus is targeting up to a 2x improvement in design turnaround time (TAT) compared with traditional semiconductor design workflows.
Rapidus is also expanding its Raads platform with two new tools—Raads Navigator and Raads Indicator—designed to improve quality assurance and assist engineers in identifying and resolving design issues. The tools have been integrated with the Cadence InnoStack AI Super Agent to support agentic design orchestration from architectural exploration through implementation and signoff.
The companies said the integration leverages data-driven optimization throughout the chip design process, helping engineering teams manage the growing complexity of advanced-node semiconductors while improving predictability and productivity.
Cadence President and CEO Anirudh Devgan said advanced-node SoC development increasingly requires AI agents capable of orchestrating entire design workflows rather than optimizing individual tasks. He added that the collaboration extends agentic AI into a leading-edge semiconductor ecosystem, enabling customers to bring advanced silicon to market more quickly.
Rapidus Representative Director and CEO Dr. Atsuyoshi Koike highlighted the company’s vision of building an AI-native semiconductor foundry, where artificial intelligence is integrated across nearly every stage of manufacturing. He said combining Raads with Cadence’s AI technologies will help customers maximize the benefits of Rapidus’ advanced process technologies while significantly reducing design turnaround time.
The collaboration will be featured at CadenceLIVE Japan 2026, where Rapidus will discuss how agentic AI and electronic design automation (EDA) technologies are being used to improve efficiency and quality in next-generation semiconductor development.
